The materials of tomorrow are here. But manufacturing hasn’t caught up.
K1’s platform technology changes that.
From AI data centers and autonomous vehicles to quantum computers, and space technologies, the next wave of innovation demands chips that endure extreme heat, radiation, and voltage.
Yet the materials that make this possible are expensive and nearly impossible to manufacture with at scale. That’s the bottleneck. Not chip design. Not capital. Materials!
When we think about semiconductor chips, we think about nanometer precision. But at the foundation of it all lies a process stuck in the 1970s. Wafers are sawn and ground away, wasting over 65% of valuable material in the process.
The irony is that the most sophisticated industry in the world is running on one of the most inefficient processes.
K1’s wafer-splitting (“spalling”) platform technology enables reuse of advanced, expensive semiconductor wafers while also producing ultra-thin layers that can enable heterogeneous “engineered” wafers delivering a generational performance gain.
K1 is led by a multidisciplinary team of scientists, engineers, and business operators — backed by world-class advisors experienced in semiconductor manufacturing, deep-tech commercialization, and venture investing.
Join us in shaping the future through joint research, technical pilots, co-development, and strategic investment.
© 2025 K1 Semiconductor, Inc.
