The materials of tomorrow are here. But manufacturing hasn’t caught up.
K1’s platform technology changes that.
From AI data centers and autonomous vehicles to quantum computers, and defense systems, the next wave of innovation demands chips that endure extreme heat, radiation, and voltage.
Yet the materials that make this possible are scarce, expensive, and difficult to manufacture with at scale. That’s the bottleneck!
When we think about semiconductor chips, we think about nanometer precision. But at the foundation of it lies a process stuck in the 1970s.
Wafers are sawn and ground away, wasting over 65% of valuable material in the manufacturing process. This inefficiency inflates costs, limits supply, and holds innovation back. But not anymore.
K1’s wafer-splitting (“spalling”) platform technology enables reuse of advanced, expensive semiconductor wafers upto 20 times while also producing ultra-thin layers that can enable heterogeneous “engineered” wafers delivering a generational 20% performance gain.
K1 is led by a multidisciplinary team of scientists, engineers, and business operators — backed by world-class advisors experienced in semiconductor manufacturing, deep-tech commercialization, and venture investing.
